发明名称 |
Mounting device for semiconductor devices |
摘要 |
The mounting for electronic semiconductor devices is in the form of a strip frame that can be of metal and this is bonded to a band. The semiconductors are inserted into the centres of each frame location and the connecting wires are fixed. The semiconductors are then embedded into a synthetic resin which is then hardened. A solder or welding operation provides connection to tracks and the mounted devices are separated from each other.
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申请公布号 |
FR2758209(A3) |
申请公布日期 |
1998.07.10 |
申请号 |
FR19970008781 |
申请日期 |
1997.07.10 |
申请人 |
ORIENT SEMICONDUCTOR ELECTRONICS LTD |
发明人 |
HSIEN WEN LO |
分类号 |
H05K13/00;(IPC1-7):H01L23/12;H01L23/28 |
主分类号 |
H05K13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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