| 发明名称 |
METHOD OF MAKING HIGH PURITY COPPER SPUTTERING TARGETS |
| 摘要 |
Described is a method of making high purity copper sputtering target. The method avoids melting and casting and involves stacking segments of high purity copper plates, and heating, forging and annealing to produce a diffusion bonded unitary structure.
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| 申请公布号 |
WO9829213(A1) |
申请公布日期 |
1998.07.09 |
| 申请号 |
WO1997US23847 |
申请日期 |
1997.12.22 |
| 申请人 |
JOHNSON MATTHEY ELECTRONICS, INC. |
发明人 |
KARDOKUS, JANINE, K. |
| 分类号 |
C23C14/34;(IPC1-7):B23K20/00 |
主分类号 |
C23C14/34 |
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