CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION

摘要

Curatives for epoxy resins and curing accelerators for epoxy resins which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures. The curative is characterized by being a clathrate comprising a tetrakisphenol compound represented by general formula (I) and a compound which reacts with the epoxy group of an epoxy resin to cure the resin, wherein X represents (CH2)n, where n is 0, 1, 2, or 3; and R<1> to R<8> each represents hydrogen, lower alkyl, optionally substituted phenyl, halogeno, or lower alkoxy; and the other curative is characterized by being a clathrate comprising a tetrakisphenol compound represented by general formula (I) and a compound accelerating the curing of a compound which reacts with the epoxy group of an epoxy resin to cure the resin.