| 摘要 |
An integrated circuit package. The package includes a substrate that has a first internal conductive bus and a second internal conductive bus that are located on a common layer of the substrate and dedicated to different power voltage levels. The busses are coupled to external lands located on a first surface of the package by vias that extend through the substrate. The first and second busses are located on a common layer of the substrate. The package contains an integrated circuit which is mounted to a heat slug that is attached to a second surface of the package. The integrated circuit is coupled to bond fingers located on a shelf of the substrate. Some of the bond fingers are connected to the internal busses by conductive strips that wrap around the edges of the shelf. Some of the vias are connected to a whole group of external lands. Grouping the lands to a single via reduces the number of vias on the second surface of the package. The reduction in vias allows additional capacitors to be mounted to the second surface of the package. |
