摘要 |
<p>A strengthened polyimide film is described, which has improved adhesion when bonded to a metal foil through a heat-resistant adhesive, containing from 0.02 to 1% by weight, based on the weight of the film, of an organo-metallic compound wherein the metal is tin, bismuth or antimony. A process for preparing a strengthened polyimide film is also described wherein an organometallic compound is introduced into a film-forming polyamic acid polymer prior to the casting step.</p> |
申请人 |
E.I. DU PONT DE NEMOURS AND CO., WILMINGTON, DEL., US |
发明人 |
ARDUENGO, ANTHONY, JOSEPH, III, WILMINGTON, DE 19809, US;RAY, YIA, CHING, PALISADES PARK, NJ 07650, US |