| 摘要 |
A method for testing electronic devices attached to a leadframe includes positioning more than one electronic device attached to a common leadframe underneath a test fixture. The test fixture then contacts the devices to perform an electrical test. Testing more than one device at a time while they are attached to a common leadframe greatly improves efficiency of the testing process. Furthermore, positioning the devices below the test fixture reduces the amount of contamination that may settle on the test fixture. Plural test apparatuses 72,74,76 are arranged to feed a trim-and -form apparatus 78 such that the trim-and-form apparatus is constantly active. The leadframe and associated electronic devices are transported by a walking beam from a heated storage area to the test site, then to a further storage area. The walking beam may be heated and an inker may mark failed devices. |
