| 摘要 |
A method for estimating temperature of an electronic device (10) mounted on a rigid element e.g. heat sink or casing (60), by measuring the temperature of a thermally conductive coupling (20) attached to the electronic device using a first temperature sensor (30), and by measuring the temperature of the rigid element using a second temperature sensor (40). The coupling and the first temperature sensor are thermally insulated from the rigidiser, and by combining the measurements from the first and the second temperature sensors and using a thermal model (Figs. 2, 3) a measurement of the temperature of the electronic device is provided. |
