Method for fabricating highly conductive vias

摘要

The present inventors have discovered that the thickness uniformity of a plated metal layer inside a via hole can be enhanced by intersecting a conductive via (21) with an insulating aperture (40) before plating. The new via configuration improves the mass transfer of the plating. It is believed that the apertures lower the local solution ohmic resistance near the via holes. The method can be applied to the manufacture of a wide variety of circuit boards.