| 摘要 |
A method of washing substrates comprises the steps of (a) introducing a washing solution (101) into a processing vessel (10) having a wafer boat (30) movably mounted therein to fill the vessel (10) with the washing solution (101), (b) allowing a plurality of wafers (W) to be held collectively by a chuck (20a) such that the wafers (W) held by the chuck (20a) are arranged at substantially an equal pitch, (c) dipping the wafers (W) together with the chuck (20a) in the washing solution (101) within the processing vessel (10), (d) transferring the wafers (W) from the chuck (20a) onto the wafer boat in an upper region (12) of the processing vessel (10), (e) moving the wafers (W) together with the wafer boat (30) within the washing solution (101) to allow the substrates to be positioned in a lower region (11) of the processing vessel (10), (f) discharging the washing solution (101) from the upper region (12) of the processing vessel (10), (g) supplying a fresh washing solution (101) into the lower region (11) of the processing vessel (10) so as to cause the washing solution (101) within the processing vessel (10) to overflow the processing vessel (10), (h) taking the washed wafers (W) out of the processing vessel (10). <IMAGE> <IMAGE> |
