| 发明名称 |
Closed-loop dome thermal control apparatus for a semiconductor wafer processing system |
| 摘要 |
<p>The disclosure relates to a closed-loop, dome thermal control apparatus (100) containing a high-volume fan (106), a heat exchange chamber (114), and an enclosure (130), that encloses the fan and the heat exchange chamber. The fan blows air over a dome (102), of a semi-conductor wafer processing system and through the heat exchange chamber (114), to uniformly control the temperature of a dome of a plasma chamber to prevent particle contamination of the wafer. The enclosure recirculates the temperature controlled air to the fan to form a closed-loop apparatus. <IMAGE></p> |
| 申请公布号 |
EP0852392(A2) |
申请公布日期 |
1998.07.08 |
| 申请号 |
EP19970310167 |
申请日期 |
1997.12.16 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
RYAN, ROBERT E.;LEAHEY, PATRICK;HATCHER, BRIAN;QIAN, XUEYU;CHEN, JERRY C.;DRISCOLL, TIMOTHY;GUENTHER, ROLF;REMINGTON, RICHARD E.;YAVELBERG, SIMON |
| 分类号 |
H01L21/302;H01L21/00;H01L21/3065;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/302 |
| 代理机构 |
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| 主权项 |
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| 地址 |
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