发明名称 |
METHOD AND APPARATUS FOR BENDING SYNTHETIC RESIN PLATE |
摘要 |
PROBLEM TO BE SOLVED: To bend a synthetic resin plate by a non-heating method without generating blushing or crack by forming a waveform uneven shape on the elastically deformed plate, and fixing a predetermined mold corresponding to the previous shape to the deformed plate. SOLUTION: The synthetic resin plate bending apparatus 1 comprises a waveform shaping unit 3 for elastically deforming a synthetic resin plate 2 inserted substantially horizontally in a waveform shape, and a shaping unit 6 for fixing a predetermined mold to the deformed plate 2 delivered from the unit 3. The unit 3 has width deciding rollers 31R in contact with both ends of the plate 2, a first pressing roller 32A arranged laterally of the plate 2 at a surface side of the plate 2, and a second pressing roller 33A as a pair with the roller 32A at a position opposite to the roller 32A. |
申请公布号 |
JPH10180862(A) |
申请公布日期 |
1998.07.07 |
申请号 |
JP19960349387 |
申请日期 |
1996.12.27 |
申请人 |
MITSUBISHI GAS CHEM CO INC |
发明人 |
HAMAYA KUNIO;MASUMOTO ISAMU;OYAMA IKUO;NARA TSUTOMU |
分类号 |
B29C53/26;B29C53/22;B29L7/00;B29L31/60;(IPC1-7):B29C53/26 |
主分类号 |
B29C53/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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