| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive film having good heat resistance, adhesiveness, chemical resistance, and flexibility by compounding a high-mol.-wt. epoxy resin, a modified polyamide, a polyfunctional epoxy resin, and curative. SOLUTION: A high-mol.-wt. epoxy resin in an amount of 100 pts.wt., having a wt. average mol.wt. of 50,000 or higher and obtd. by thermally copolymerizing a difunctional epoxy resin and a difunctional phenol resin in the presence of a catalyst in a polymn. solvent, 10-200 pts.wt. modified polyamide having a polyalkylene glycol residue or a polycarbonate diol residue and obtd. by reacting an epoxy resin with a polyamide, 5-200 pts.wt. polyfunctional epoxy resin having at least two epoxy groups in the molecule, and a curative, are dissolved in a solvent. The resultant varnish is applied to a substrate in the form of a plate or a roll and dried to give an adhesive film for printed circuit boards. |
