A lead conditioning system (10) conditions leads (74) of electronic component package (30) and includes a rotary table (16) for holding electronic component package (30) and making accessible the leads (74). A conditioning tool (20) includes conditioner arm (34) and conditioner blade (70) that selectively contacts a predetermined number of the leads (74). A manipulator (22) moves conditioning tool (20) to positions that contact a predetermined number of leads (74) to condition leads (74). A control system (24) controls the operation of manipulator (22).
申请公布号
US5777886(A)
申请公布日期
1998.07.07
申请号
US19940275162
申请日期
1994.07.14
申请人
SEMICONDUCTOR TECHNOLOGIES & INSTRUMENTS, INC.
发明人
GLUCKSMAN, MICHAEL D.;WAHAWISAN, WEERAKIAT;MOORE, TROY D.;HASTEN, PAUL H.;BOTKIN, DENNIS M.;LOVELESS, JAMES E.;ANTAO, JOSEPH;ZEMEK, MICHAEL C.;ROY, RAJIV