| 摘要 |
PROBLEM TO BE SOLVED: To uniformly polish the surface of a part with complex sectional profile with efficiency. SOLUTION: A polishing pad 1 in a polishing tool 3 is made of elastic material adapted to deform in conformity to the sectional profile of a workpiece A upon its pressure thereon. A working tank 13 is filled with an abrasive solution 10 including grinding grains of elevated solid phase reactivity to the workpiece A. Since the grinding grains in the abrasive solution 10 are charged, the application of a voltage between the mount 3a of the polishing tool 3 and an electrode 9 to polarize the mount 3a as opposed to the grinding grains attracts them to bores 2 formed in the polishing pad 1. That results in continuous feeding of sufficient grinding grains to the machining surface of the polishing pad 1. The sliding motion of the polishing pad 1 and the workpiece A crowds the grinding grains attracted to the bores 2 of the polishing pad 1 into grooves a1 cut in the workpiece A. The grinding grains thus crowded positively exerts its chemical polishing action on the grooves a1 where the mechanical polishing action of the grinding grain cutting edge is hard to be exerted as compared with the other regions a2 of the workpiece A. |
