| 摘要 |
Semiconductor devices suited for high-density packaging, a method of connecting such semiconductor devices, and connectors for connecting such semiconductor devices. Each semiconductor device 10 includes a plurality of exposed terminals 13 arranged two-dimensionally on opposite surfaces thereof. Each connector 30 includes a plurality of connecting pins projecting from opposite surfaces thereof and arranged two-dimensionally in a corresponding relationship to the exposed terminals 13. Each end connector 33 includes connecting pins 34 likewise arranged two-dimensionally on an inward surface thereof. These connectors 30 and 33 are used to sandwich a plurality of semiconductor devices 10 to form a package. The exposed terminals 13 of the semiconductor devices 10 are electrically connected through the connecting pins of the connectors 30 and 33.
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