Non-aqueous solvent free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers

摘要

The invention herein is a non-aqueous solvent free process for producing UV curable adhesive and sealant compositions comprising a tackifying resin and a monohydroxylated epoxidized polydiene polymer which is comprised of at least two polymerizable ethnically unsaturated hydrocarbon monomers wherein at least one is a diene monomer which yields unsaturation suitable for epoxidation and wherein the polymer contains from 0.1 to 7.0 milliequivalents of epoxy per gram of polymer. The process involves mixing the components with an insoluble photoinitiator under conditions of high shear and/or cavitation. The invention also relates to a film of 5 mils to one inch thick which is formed from the composition made according to the process above.