| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject material useful for lacquer ware, etc., having excellent antimicrobial properties and mildewproofing properties and durability of these properties, by using an organic peroxide as an antimicrobial component. SOLUTION: This phenol resin molding material comprises preferably 0.1-3.0 pts.wt. of an organic peroxide as an antimicrobial component. The peroxide has preferably >=100 deg.C thermal decomposition temperature. To be concrete, dicumyl peroxide, di-t-butyl peroxide,α,α'-bis(t-butylperoxy-m-isopropyl)benzene, etc., are used as the peroxide. Further an inorganic filler or an organic filler is preferably used.
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