| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable electronic parts by incorporating at least one kind of Fe and Ni of the prescribed quantity into Sn as the lead-free soldering material and performing the soldering through a Ni film thereby improving joining performance. SOLUTION: The lead-free soldering material has the composition consisting of, by weight, at least one kind of 0.01-5.0% Fe and Ni, and the balance Sn with inevitable impurities, preferably, 0.01-4.99% Fe, 0.01-4.99% Ni while the sum of Fe and Ni is 0.02-5.0%, and the balance Sn with inevitable impurities. An electronic member is joined with a substrate to form an electronic parts through the Ni film using the lead-free soldering material of this composition. In the soldering material, Sn raw material is preferably >=99.9wt.%, and the higher its purity is, the more the mixing of Pb can be avoided. The joining property with Ni interposition can be improved even in the Sn-based lead-free soldering material by the multiplier effect of at least one kind of Fe and Ni with Sn. |
