EXTRUSION DIE AND PRODUCTION OF EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR USING THE SAME

摘要

PROBLEM TO BE SOLVED: To easily extrude a granulated product in a strand shape without lowering characteristics. SOLUTION: This compsn. contains an epoxy resin, a phenol resin curing agent, an inorg. filler and a curing accelerator as essential components. When the epoxy resin compsn. for sealing a semiconductor containing the inorg. filler in an amt. of 65-95% by wt. of the total resin compsn. is extruded into a strand having a desired cross section at 50-120 deg.C by using a single-screw extruder 2, an extrusion die 3 wherein the center positions of strand extruding die holes 4 are provided between the outer diameter of a screw 5 and the inner diameter of a cylinder is used.