Semiconductor device constructed by mounting a semiconductor chip on a film carrier tape

摘要

Copper foil wiring is applied to base film and the wiring is in turn covered by a cover resist. The electrodes of a semiconductor IC chip is connected to the inner leads of the copper foil wiring and the semiconductor chip is then encapsulated by encapsulation resin. Solder balls are supplied to lands through openings in the cover resist, and bumps are formed. The four sides of the film are then folded to form folded portions. These folded portions increase the strength of the edges of the film, thereby reducing warping and waviness and allowing simultaneous mounting of other devices such as QFP to the substrate. The angle of folding with respect to the film surface is preferably 20 DEG or greater and less than 90 DEG , and still greater strength can be obtained by two-stage folding of the sides.