A device for holding a semiconductor wafer cassette to enable manipulation of the cassette during semiconductor manufacturing processes is disclosed. The device includes a shielding plate for enclosing an open face of a semiconductor wafer cassette. A pair of gripping arms are pivotally connected to edges of the shielding plate for grasping the edges of a semiconductor wafer cassette in response to actuation by a trigger and linkage contained within a handle of the device. The trigger actuates the gripping plates between an opened and closed position. When the cassette is gripped, it may be manipulated in the horizontal and vertical directions by an operator using the handle of the device.
申请公布号
US5775752(A)
申请公布日期
1998.07.07
申请号
US19960651995
申请日期
1996.05.20
申请人
NIEMIROWSKI, GEORGE E.;HARRELL, JOHN M.;NIEMIROWSKI, ADAM F.
发明人
NIEMIROWSKI, GEORGE E.;HARRELL, JOHN M.;NIEMIROWSKI, ADAM F.