发明名称 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in stability during its storage. SOLUTION: This epoxy resin composition comprises (A) an epoxy resin, (B) a phenolic resin, (C) a filler composed of at least one kind of acidic metal element compound selected from the group consisting of aluminum oxide, silicon dioxide, silicon carbide, trisilicon tetranitride, boron nitride and boron carbide and satisfying the condition (α) described below: (α)ΔH/mC is 400-1,500kcal (ΔH is the heat of dissociation of the metal element oxide; (m) is the number of cations; C is the number of coordination to oxygen atom), and (D) curing promoter-contg. microcapsules having core/shell structure with its curing promoter core portion coated with polyurea shell portion.
申请公布号 JPH10182949(A) 申请公布日期 1998.07.07
申请号 JP19960349454 申请日期 1996.12.27
申请人 NITTO DENKO CORP 发明人 HOSOKAWA TOSHITSUGU;HARADA TADAAKI;IKEMURA KAZUHIRO;MISUMI SADAHITO;NISHIOKA TSUTOMU;TANIGUCHI TAKASHI
分类号 C08K3/22;C08G59/62;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08L63/00 主分类号 C08K3/22
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