| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition excellent in preserving stability, flow property, forming property, reliability in moisture resistance and solder cracking resistance, and useful as a semiconductor sealing material by using a specific epoxy resin and a curing agent as indispensable compositions. SOLUTION: This epoxy resin composition is obtained by containing (A) an epoxy resin containing >=50wt.% compound having a crystalline state at a room temperature, containing aβposition-substituted glycidyloxy group in its molecular structure and having preferably a structure of the formula [X is a condensed polycyclic hydrocarbon or a hydrocarbon obtained by bonding 2 aromatic nuclei through a joining group; R is an alkyl, an aryl, an acyl or H; (n)=0] and (B) a curing agent, preferably a phenolic compound, as indispensable components, and further preferably containing (C) an inorganic filler.
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