发明名称
摘要 <p>PURPOSE:To provide an easy method for forming a laminated printed wiring board having excellent characteristics as a printed wiring board for high-frequency circuits and a low dielectric constant. CONSTITUTION:After a composition containing p-xylylene bis(diethyl sulfonium salt) copolymer and polyfunctional vinyl compound is put between printed wiring boards, crosslinked poly(p-phenylenevinylene) is formed by heating the composition to cause eliminating and crosslinking reactions.</p>
申请公布号 JP2770627(B2) 申请公布日期 1998.07.02
申请号 JP19910337863 申请日期 1991.11.28
申请人 NIPPON DENKI KK 发明人 SATO MASAHARU;KOBAYASHI ATSUSHI;ISHIKAWA HITOSHI;JO SHINHI
分类号 B32B37/00;B32B7/10;C08F12/00;C08F12/30;H05K3/38;H05K3/46;(IPC1-7):H05K3/46;B29D9/00 主分类号 B32B37/00
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