| 摘要 |
An interface includes floating pad metallization (30 or 630) patterned over a dielectric interface layer with a first portion forming a central pad (26 or 626) and a second portion forming an extension (28 or 628) from the central pad extending into an interface via. Another interface includes a floating contact structure including electrically conductive material (214) coating a hole with at least some of the floating pad metallization forming an extension (216) from the hole. A conductive contact area interface includes at least one interface structure (22, 24, 26, 28, or 30) coupled between first and second contact areas (112 and 118) and including an electrical conductor having a partially open interior to form a compliant joint between the first and second contact areas. |
