Mit Harz eingekapseltes Halbleiterbauelement

摘要

A resin-sealed semiconductor device that exhibits high reliability in heat-cycle and impact resistance testing. The device comprises a resin-sealed semiconductor device (1) in which a cured resin dam (3) with a JIS A hardness of 40 to 95 is formed in the zone of the bonding wires that electrically connect the semiconductor element onto the surface of a circuit board (2) and the semiconductor element is mounted within the cured resin dam and is covered with a cured resin sealant (4) having a JIS A hardness of 1 to 39.