发明名称 Light emitting display element e.g. LED chip
摘要 <p>A light emitting display element, formed from a semiconductor wafer and mounted with its p-n junction (42) perpendicular to a wiring substrate (45), has (a) terminal electrodes (53, 54) which are formed on its two end faces perpendicular to the p-n junction (42) and which are connected to spaced connection electrodes (46, 47) on the wiring substrate (45); and (b) an electrically insulating coating (52) on at least one of its side faces between the terminal electrodes (53, 54). Also claimed is a similar light emitting display element which has the terminal electrodes described above and has a step in the side face facing the wiring substrate so that one side edge of the p-n j unction is recessed from the side end faces of the terminal electrodes. Further claimed are processes for production of the above light emitting display elements. Preferably, the insulating coating consists of an UV curable resin or of a light transparent material selected from epoxy resin, phenolic resin, silicon dioxide and aluminium oxide and the semiconductor material is selected from III-V compound semiconductors, II-VI compound semiconductors or silicon carbide.</p>
申请公布号 DE19757850(A1) 申请公布日期 1998.07.02
申请号 DE1997157850 申请日期 1997.12.24
申请人 SHARP K.K., OSAKA, JP 发明人 OOTA, KIYOHISA, NARA, JP
分类号 H01L23/29;H01L23/31;H01L33/02;H01L33/44;H01L33/62;H05K3/32;H05K3/34;(IPC1-7):H01L33/00;H01L27/10;H01L51/40 主分类号 H01L23/29
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