发明名称 METHOD AND DEVICE FOR CONNECTING ELECTRICAL COMPONENTS TO CIRCUIT BOARDS
摘要 <p>The present invention relates to a device and a method for electrical and mechanical connection of an electric high-power component (111) which transmits high-frequency electrical signals to conductors (120) on a circuit board (119). The component comprises horizontally projecting connections (114) which according to the invention are glued to the conductors on the circuit board with an electrically conducting adhesive (112), of which the adhesion to the foundation is greater than a predetermined value. The component is subject to repeated temperature changes which lead to stresses on the connection between the connections (114) and the conductors (120). The length of the connections is chosen depending on a predetermined thresold value for the highest acceptable attenuation to which the high-frequency electrical signal is subject when passing through the electrical high-power component via the connections. The contact surface of the connections towards the glued joint can be designed so that it comprises a number of cavities, whereby the adhesive achieves a better grip to the connections.</p>
申请公布号 WO1998028787(A1) 申请公布日期 1998.07.02
申请号 SE1997002114 申请日期 1997.12.16
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