Opto-electronic SMD component for data transmission

摘要

The component includes a radiation-emitting semiconductor chip (4.1) arranged on one part of a conductor stripe (3.1), and radiation-sensitive semiconductor chip (5.1) arranged on another part of the stripe. A casing encloses the stripe, with the exception of the external connection pins (3), which is, at least partially, transparent for the used radiation. The external connection pins of the conductor stripe project only from one lateral surface of the casing (2). All external connection pins are bent once directly at the casing, so that they proceed along the lateral surface, and are bent a second time at the edge to the rear of the casing, so that they proceed along the rear side. Support surface areas (6,7) are arranged at the lateral surface and at the rear side of the casing, on which the casing is supported in a respective installation direction.