Semiconductor chip housing

摘要

A semiconductor chip housing includes (i) a housing body (3) with a recess for insertion of a rectangular chip and with several insulation steps, each having a first region (3c-1), located between transverse slits along one longitudinal side of the recess, and a second region (3c-2) extending from the first region; (ii) a conductive element (4) fixed in each slit; (iii) connection elements (5) between the chip bond pads and the conductive elements; and (iv) a sealing element (6) for sealing the contact parts between the chip and the connection elements and between the conductive elements and the connection elements. Preferably, the housing body (3) consists of insulating material (preferably a cast epoxide compound, a plastic or a ceramic material), the sealing element consists of a cast epoxide compound and the chip underside has an adhesive element (preferably of an epoxide or polyimide) for fixing it in the recess. Also claimed are processes for producing a chip housing.