| 摘要 |
<p>The present invention relates to a device and a method for electrical and mechanical connection of an electric high-power component (111) which transmits high-frequency electrical signals to conductors (120) on a circuit board (119). The component comprises connections (114) projecting over the circuit board and which are soldered to the conductors (120) on the circuit board (119) with a solder material (112) which essentially lacks grain growth. The component is subject to repeated temperature changes which leads to stresses on the connection between the connections (114) and the conductors (120). The length of the connections is selected depending on a predetermined threshold value for the highest acceptable attenuation which the high-frequency electrical signal is subject to when passing through the electrical high-power component via the connections. The connections can be shaped so that they comprise a bent part with a bending which is determined in dependence of said threshold value.</p> |
