| 摘要 |
<p>A conducting foil (1) is disclosed for connecting in a conductive manner electric and/or electronic components having outwardly insulated printed circuits (2) applied on an elastically deformable, non-conductive supporting foil and connected in a conductive manner in a joining region (5) to soldering lands (3) located on the conducting foil (1). In order to prevent the printed circuits (2) from breaking away from the soldering lands (3) when the conducting foil (1) is subjected to vibrations, the joining region (5) between the printed circuits (2) and soldering lands (3) is arranged outside a bending line (B) which touches the edge of the soldering lands (3) and is fixed in relation to a movable section of the conducting foil. Under vibration stresses, the moving section (8) of the conducting foil (1) carries out bending vibrations around the bending line (B).</p> |
