| 摘要 |
<p>An inter-laminar adhesive film is provided for multi-layer printed wiring boards, the film being attached to an internal-layer circuit board where the film is embedded in an internal-layer circuit. A process of producing a multi-layer printed wiring board using the film is also provided. The adhesive film facilitates simultaneous and integral coating of an internal-layer circuit pattern and resin filling into through-holes and/or superficial via holes in a build-up process of producing a multi-layer printed wiring board in which a conductor circuit layer and an insulation layer are alternately laminated together. The adhesive film for multi-layer printed wiring boards, comprises a support film base and a resin composition which is solid at ambient temperature, both to be laminated on an internal-layer circuit board, wherein the resin composition which is solid at ambient temperature contains at least 10% by weight of a resin with a lower softening point than the lamination thickness of the conductor in the internal-layer circuit and the resin flow of the resin composition at the lamination temperature is at least of the thickness of the conductor of the internal-layer circuit, or is of the depth of a superficial via hole if present in the internal-layer circuit, or is 1/2 fold or more the depth of a through-hole in the internal-layer circuit singly or in combination with a superficial via hole. <IMAGE></p> |
