发明名称 |
Multistep method of manufacturing semiconductor wafers |
摘要 |
<p>There is disclosed a method of manufacturing a semiconductor wafer which includes at least a slicing process for slicing a semiconductor monocrystalline ingot in order to obtain a disc-shaped semiconductor wafer. In the method, the sliced semiconductor wafer is etched before being transported to a subsequent process. Even when a monocrystalline ingot having a large diameter is sliced through use of a wire saw, the method prevents generation of breakage, cracks, chips, or the like in processes subsequent to the slicing process, thereby enabling production of large-diameter wafers with high productivity and high yield through utilization of the advantage of the wire saw in slicing a large-diameter monocrystalline ingot; i.e., high cutting speed and a small amount of slicing stock removal. <IMAGE></p> |
申请公布号 |
EP0850737(A2) |
申请公布日期 |
1998.07.01 |
申请号 |
EP19970310040 |
申请日期 |
1997.12.12 |
申请人 |
SHIN-ETSU HANDOTAI COMPANY LIMITED |
发明人 |
TOYAMA, KOHEI;TAKAMIZAWA, SHOICHI;ARAMAKI, KANEYOSHI |
分类号 |
H01L21/304;B28D5/00;H01L21/302;(IPC1-7):B28D5/00 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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