发明名称 |
PROCESS AND DEVICE FOR TESTING A CHIP |
摘要 |
Method and apparatus for the testing of substrates which are provided with a wiring structure, in particular, chips (21), in conjunction with which, by means of a solder-deposit carrier (25) which is provided with a structured, electrically conductive coating (12) with bond pads (17) for the arranging of solder deposits (28) and their transfer to correspondingly arranged bond pads (22) of a substrate (21), an electrical check of the wiring structure of the substrate (21) takes place during the transfer of the solder deposits (28). |
申请公布号 |
EP0850490(A1) |
申请公布日期 |
1998.07.01 |
申请号 |
EP19960928330 |
申请日期 |
1996.07.19 |
申请人 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. |
发明人 |
ZAKEL, ELKE;ANSORGE, FRANK;KASULKE, PAUL;OSTMANN, ANDREAS;ASCHENBRENNER, ROLF;DIETRICH, LOTHAR |
分类号 |
G01R31/02;G01R1/073;G01R31/26;H01L21/48;H01L21/66 |
主分类号 |
G01R31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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