发明名称 LASER CUTTING PROCESS
摘要 <p>PCT No. PCT/JP89/01050 Sec. 371 Date Apr. 2, 1992 Sec. 102(e) Date Apr. 2, 1992 PCT Filed Oct. 12, 1989 PCT Pub. No. WO91/05631 PCT Pub. Date May 2, 1991.The present invention relates to a laser cutting process which can easily obtain a fine cut surface without attaching any dross thereto. The laser cutting process comprises the steps of: applying a piercing to a workpiece by irradiating a laser beam toward a focus thereof adjusted onto an upper surface of the workpiece under as a condition as using air having a relatively low pressure; ejecting air having a high pressure toward a cutting portion of the workpiece from a nozzle main body for emitting the laser beam mounted on a laser processing machine under the condition such that the laser beam is irradiated from the nozzle main body toward a focus thereof adjusted onto a rear surface of the workpiece or the proximity thereof; and cutting the workpiece while blowing off dross generated upon the cutting operation by means of the ejected high pressure air.</p>
申请公布号 KR0136566(B1) 申请公布日期 1998.07.01
申请号 KR19920070801 申请日期 1992.04.07
申请人 KOMATSU SEISAKUSHO KK. 发明人 MASAHIRO, YAMADA
分类号 B23K26/14;B23K26/36;(IPC1-7):B23K26/00 主分类号 B23K26/14
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