Wafer holding jig

摘要

There is disclosed a wafer holding jig having a porous holding surface for vacuum-holding a semiconductor wafer while the wafer is ground or polished. The porosity of a center region of the holding surface is made larger than that of an outside region formed to surround the center region. The outer diameter of the center region is made less than that of the wafer, while the outer diameter of the outside region is made greater than that of the wafer. It is possible to prevent deterioration in machining accuracy, which deterioration would otherwise occur due to deformation of a wafer stemming from catch of dust or the like, or application of machining pressure to the wafer.