| 摘要 |
There is provided a device and a method of surface grinding a thin-plate workpiece, which is capable of performing surface grinding to substantially remove, particularly, the waviness of 10 to 30 mm in period of a thin-plate workpiece having a sori(warp or bow) or waviness component without deterioration of the flatness and without entirely requiring an equipment investment, and which is also capable of manufacturing a semiconductor wafer with a high quality having no waviness and at low costs, which does not require the conventional lapping process and, as occasion demands, the etching process, in the case where the invention is applied to surface grinding of an as-cut wafer. The device for surface grinding a thin-plate workpiece includes a surface grinding element, and a holding element for holding the thin-plate workpiece to be surface ground, wherein a soft holding element is used as the holding element. <IMAGE> |
