| 摘要 |
A multi-layer wiring board, the conductor pattern formation density of which can be further increased and the manufacturing process of which can be simplified comprises: a plurality of resin base plates (12, 12, ...) laminated on each other so that they are integrated into one body, a conductor pattern (10) being formed on one side of each resin layer (14); and conductive vias (18) to connect the conductor patterns (10, 10, ...) laminated on each other through the resin layers (14). The conductive vias (18) are formed when metal is filled by means of plating into recess portions (16) which penetrate the resin layers (14) so that the conductor pattern (10) formed on one side of each resin layer (14) is exposed onto a bottom surface of the recess portion and that the surfaces of the conductive vias can be substantially at the same level as the surface of the other side of each resin layer (14), whereby the exposed surfaces of the conductive vias (18) exposed on the other side of the resin layer (14) are electrically connected to the conductor pattern (10) formed on the one side of another resin base plate (12). <IMAGE> |
