| 摘要 |
<p>PCT No. PCT/DE96/01592 Sec. 371 Date Jun. 29, 1998 Sec. 102(e) Date Jun. 29, 1998 PCT Filed Aug. 28, 1996 PCT Pub. No. WO97/09739 PCT Pub. Date Mar. 13, 1997Solder deposit carrier for the selective soldering of terminal areas of a substrate, comprising on an electrically conductive, non-wettable or wetting-inhibiting coating (12) a transfer mask (13) of an electrically isolating, non-solderable material which exposes the coating in the area of mask openings (14), in which the mask openings (14) serve to accommodate solder deposits (16) electroplated to the coating (12), and the coating (12) comprises two superimposed metal layers (15, 17) of different materials, such that the layer (17) facing towards the mask openings (14) is non-wettable or has a wetting-inhibiting effect, and the layer (15) arranged facing away from the mask openings (14) acts as a current-carrying layer during the electroplating.</p> |
