Surface mountable semiconductor chip housing

摘要

A surface mountable semiconductor chip housing has double-layered solder bumps (3) as external connections on the underside of the housing body (2). Preferably, each solder bump has a solder layer (5) of 90/10 Sn/Pb alloy on a flat metal support layer (4), preferably a 45 mu thick copper thin film, with an intermediate adhesion promoting plated metal layer (6) preferably of Ni-Au or Sn-Pb alloy. Also claimed is a process for producing a surface mountable chip housing by (a) producing a support layer, in electrical connection with an external connection electrode at the underside of the connection substrate acting as a housing body; and (b) joining a solder layer to the support layer so that, after the chip moulding step in production of the housing, a double-layered solder bump is obtained.