| 摘要 |
A heating and lifting mechanism for positioning a semiconductor wafer within a processing chamber is provided including a pedestal for supporting the wafer within the process chamber, a drive shaft extending downwardly from a lower region of the pedestal, which has a lead screw at a distal portion thereof, and a drive mechanism, which is coaxial with the drive shaft, for providing linear vertical translation of the shaft and pedestal. The device also includes a CONFLAT TM assembly located between the pedestal and drive shaft. The CONFLAT TM assembly includes upper and lower substantially flat planar plates removably connected to one another. The upper plate is connected to a lower region of the pedestal, and the lower plate is connected to an upper end of the drive shaft. The CONFLAT TM assembly permits removal of the heater pedestal without removing the entire lift assembly.
|
