发明名称 ADHESIVE COMBUSTION FOR SEMICONDUCTOR DEVICE AND ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To enable improvement in reliability, reflow resistance, and thermal cyclic property, by producing a thermosetting adhesive made of epoxy resin and thermoplastic resin as an adhesive composition. SOLUTION: Thermoplastic resin, epoxy resin, and other additives are mixed at a predetermined composition ratio, and stirred and dissolved in a DMF/ monochlorobenzene/MIBK mixture solvent to a concentration of 28wt.%, thus preparing an adhesive solution. The adhesive solution is applied to and dried on a silicone-coated polyethylene terephthalate film, thus preparing an adhesive sheet. Meanwhile after the adhesive solution is similarly applied to and dried on a polyethylene terephthalate film of less peel strength than that of the former polyethylene terephthalate film, adhesive surfaces of the former adhesive sheet and the latter adhesive sheet are laminated to produce an adhesive sheet.
申请公布号 JPH10178041(A) 申请公布日期 1998.06.30
申请号 JP19970216513 申请日期 1997.08.11
申请人 TORAY IND INC 发明人 SAWAMURA TAIJI;ANDO YOSHIO;KIGOSHI SHOJI
分类号 C09J7/00;C09J11/04;C09J113/00;C09J163/00;C09J201/00;C09J201/08;H01L21/60;H01L23/12;H05K3/38 主分类号 C09J7/00
代理机构 代理人
主权项
地址