| 摘要 |
PROBLEM TO BE SOLVED: To effectively mold even in a structure that resin thicknesses of upper and lower sides of a lead frame are not uniform, in order to form in mold simultaneously a hybrid integrated circuit substrate and power transistors and make compatible miniaturization and high reliability. SOLUTION: A hybrid integrated circuit substrate 7 and power transistors 6 are mounted on a lead flame FL, and they are electrically connected via wires 9, 15. The lead flame FL is nipped between an upper die and a lower die, and also inner leads 13a to 13d are projected from near an air bent in a cavity 3. Resin is injected from a gate 4, so that resin is passed on an upper side and a lower side of the lead flame FL and is passed on an upper face of the inner leads 13a to 13d. Thereafter, the cavity 3 is filled with resin passing on an upper side of the lead frame FL and resin passing on a lower side of the lead frame FL. |
