| 摘要 |
PROBLEM TO BE SOLVED: To avoid the mixture of air in a sealing resin by a method wherein at least wire parts are covered with a first resin with a relatively low viscosity while a second resin laminated on the first resin covering the bare chip is specified to have a relatively high viscosity. SOLUTION: A bare chip 2 and wire bonding wires 4 are sealed with a resin 5 such as an epoxy resin so as to be protected. As for the resin 5, two kinds of resins are prepared so that the first resin 6 may cover at least the wire parts 4 while the second resin 7 may be laminated on the first resin 6 while covering the bare chip 2. That is, assuming the viscosities of the first and second resins 6 and 7 to be ρ1 and ρ2 , an inequality of ρ1 <ρ2 is satisfied. That is, the first and second resins 6 and 7 are respectively specified to be relatively in low and high viscosities. Through these procedures, even if the pitches between the wires 4 are narrowed, the first resin 6 specified in the lower viscosity can intrude into the spaces between the wires 4 thereby enabling the air near the wires 4 and connecting parts between the bare chip 2 and the printed-wiring board 1 to be extruded outward. |
