| 摘要 |
PROBLEM TO BE SOLVED: To improve workability, adhesive strength, insulation reliability and durability by a method wherein at least one or more kinds of resin and thermosetting resin, containing an ester coupling in the main chain, are contained as the essential component of an adhesive composition. SOLUTION: An adhesive solution is formed by adding polyester resin, epoxy resin, NBR rubber transformation epoxy rein and 1-cyanoethyl-2-ethyl-4-methyl- imidazole to a methylethyl ketone/N-methylpyrrolidone/toluene mixture so as to obtain the prescribed compositional ratio. The adhesive solution is applied to a polyethylene terephthalate film having a silicone mold releasing agent, and the applied adhesive solution is dried up. On the other hand, an adhesive layer is formed in the same method excepting the use of a polyethylene terephthalate film having the silicone mold releasing agent of low peeling strength. Then, an adhesive sheet for semiconductor device is formed by laminating two sheets of layers formed by putting together the adhesive surfaces of the above-mentioned film, the sheet is laminated on a pure copperplate, and an adhesive layer attached pure copperplate is obtained. |
