| 摘要 |
PROBLEM TO BE SOLVED: To facilitate balancing of the modulus of elasticity and the coefficient of linear expansion with respect to an adhesive force, by combining thermoplastic resin and thermosetting resin so as to control the temperature dependence of the modulus of elasticity and the coefficient of linear expansion. SOLUTION: An adhesive composition, forming an adhesive layer 6 of a semiconductor integrated circuit board having at least one layer each of a wiring board layer including an insulating layer 3 and a conductor pattern, a layer 7 in which no conductor pattern is formed, and the adhesive layer 6, contains at least one type of thermoplastic resin and at least one type of thermosetting resin, as an essential condition. This adhesive composition, within a temperature range of -50 to 150 deg.C after thermosetting, has a storage modulus of preferably 0.1 to 10000MPa, and more preferably 1 to 5000MPa, and a coefficient of linear expansion of preferably 0.1×10<-5> to 50×10<-5> deg.C<-1> and more preferably 1 to 30×10<-5> deg.C<-1> . |
