| 摘要 |
PROBLEM TO BE SOLVED: To improve reflow resistance property and thermal cycle property by using an epoxy resin and a thermoplastic resin that contains a specific epoxy resin as an essential constituent as an adhesive composition which constitutes an adhesive layer. SOLUTION: An epoxy resin A that contains, as an essential constituent, an epoxy resin (a) indicated by an expression and a thermoplastic resin B are used as an adhesive composition which constitutes an adhesive layer. Two of R1-R8 in the expression indicate epoxypropyl group and the remainder indicators hydrogen atom and low-class alkyl group of C1-C4 or halogen atom. The epoxy resin (a) is contained in an epoxy resin A preferably by 60wt.% or higher and the epoxy resin A is contained in the adhesive composition preferably by 20-60wt.%. A thermosplastic resin B contained in the adhesive layer preferably has, for example, amino group, carboxyl group, epoxy group, hydroxyl group, methylol group, isocyanate group, and vinyl group as a functional group that can react with the epoxy resin. |
