| 摘要 |
<p>PROBLEM TO BE SOLVED: To device so as to inhibit peeling off of a resin burr at an air vent (air release groove) of a lead frame, due to an impact at cutting/molding of a lead, and to inhibit poor conduction which results from press-bonding to a solder plate. SOLUTION: A resin burr 2a, leaking out of a resin sealing part 1, flows in an air-release groove sticks to a lead frame rail 2. A hole 2b for cutting/ removing the resin burr is formed near the resin burr 2a. With a resin sealing range being an inner lead 4 while an exposure range is an outer lead 3, a rail 2 is connected to an outer lead 3 with a tie bar 5, and a solder is plated over the entire surface except for the resin-sealing part before/after cutting of the tie burr 5. On the surface of a semiconductor element 8, which is a plate rectangular chip of Si single crystal, a fine circuit is formed and jointed to an island 7 with a resin and a metal bond. With multiple metal bonding pads 9 formed on the element 8, the pads and the inner lead 4 are connected with a bonding wire 10 of metallic thin line.</p> |
