| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device with a built-in heat-radiating plate, wherein, being miniaturization and weight reduction possible, such high heat-accumulating part as circuit chip are mounted in high density and the heat-resistance of IC package can be reduced. SOLUTION: A semiconductor device in which a main body 5 is mounted so as to contact the heatθradiating pattern provided on a substrate 1, a heat- radiating plate 6 and a circuit chip 7 laminated on the heat-radiating plate 6 through a heat-conductivity adhesive layer 9 are housed in the main body 5, with a part of the heat-radiating plate 6 so exposed as to contact the heat- radiating pattern provided on the substrate 1.
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